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IPC APEX EXPO Committees: IPC Roadmap and JNAC reports
Roadmap The 8-41 Roadmap Subcommittee released the IPC Technology Roadmap for 2011 just prior to IPC APEX EXPO and officially began the process of creating the 2013 release. The subcommittee spent an...
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Some solutions for intermittent problems
Intermittent field problems are among the most expensive warranty issues to handle. It can take years to find the root cause, then figuring out a solution to eliminate the problem can be difficult. So...
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IPC APEX EXPO Standards Development Reports: Flex Circuits
These committee reports from IPC APEX EXPO have been compiled to help you keep up on IPC standards. Visit www.ipc.org/committees for more information on standards development, drafts and minutes. The...
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Peering into X-ray inspection
Testing is becoming more difficult as densities rise and more of the solder connections are hidden from view. X-ray inspection is one of the techniques that pays big dividends, but getting the best...
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Creating a Battery Declaration Standard
Kelly St. Andre, PTC, discusses the newly formed 2-18g Declaration of Batteries and Battery Materials Task Group and its work on creating a battery declaration standard. Watch the video now. Filed...
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Printed electronics efforts grow in the background
There are big time predictions for printed electronics, a technology that’s been a technology of tomorrow for a fair while. Though there have been plenty of “next big thing” flops in electronics, it...
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UL’s Reclassification of FR-4 Ballot Results
The reclassification of FR-4 has been a work-in-progress for decades. IPC has stimulated much dialogue and debate on this subject at IPC/UL sponsored industry advisory meetings over the past few years....
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IPC Midwest speaker details many benefits of nanomaterials
In a rapid-fire presentation before a standing room only crowd, nanotechnology expert Alan Rae kicked off IPC Midwest by describing multitude of ways in which nanomaterials may impact different...
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Feel the power
As microcontroller frequencies grow, low-cost processors can manage more devices with high precision. That’s driving a huge market for actuators like motors. In turn, that is fueling substantial growth...
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View from Europe: Solderability and Reliability in Focus at IPC Conference in...
By Lars Wallin, IPC European Representative At the IPC Conference on Solderability and Reliability for Electronics Assemblies in Budapest, Hungary, 130 attendees gathered on February 6–7, to learn more...
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IPC Electronics Systems Technology Conference (IPC ESTC) Leads off with...
Dr. Tin-Lup Wong, distinguished engineer and executive director for Lenovo got IPC ESTC in Las Vegas off to a great start. Dr. Wong gave a keynote presentation that provided attendees an outstanding...
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Bob Willis Reviews New Technical Titles
Industry expert Bob Willis has tips on new reference books and IPC standards to help you do your job better. View pdf summary here. Filed under: IPC, Standards, Technical Tagged: bob willis, IPC...
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Enthusiasm Marks the IPC Difference
All too often, we’re forced to deal with people who are largely apathetic about their jobs, or those who pay little attention to detail. One of the refreshing aspects of IPC involvement is the high...
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IPC-2581 Consortium Opens its Doors to New Members
Getting OEMs, design tool providers, EMS providers and others to agree on a standard for transferring data files has proven a difficult challenge. The IPC-2581 Consortium, formed to help industry...
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IPC Standards Committee Reports: Assembly & Joining, Cleaning & Coating,...
These standards committee reports from IPC’s Fall Standards Development Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the first in a...
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New Microvia Definition Seeing Broader Usage
In 2013, IPC changed its definition of a microvia. Before then, a microvia was defined as any printed board with holes that have a diameter of equal to or less than 0.15 mm [0.006 in]. Over time, that...
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New Simplified Pricing Structure for IPC Standards and Technical Documents
On January 12, 2014, IPC implemented a new, simplified pricing structure for standards and technical documents. The new pricing structure is based on the complexity of the document (number of pages,...
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Failure Analysis for Improved Reliability
Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the...
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Copper Pillar Packaging Development Poses Challenges, but Technology Helps...
Designers of electronic products are always pushing to reduce size and weight while adding more functionality. That often puts them at the forefront of the evolution of high density chips and printed...
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DFX or How I Learned How to Stop Worrying by Designing Reliability In
One of the most useful things I’ve learned after spending more than 15 years as a process engineer is that assembly processes can easily make a design worse but they can never make it better. Decisions...
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